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Author Archives: sren

“High Temperature Copper-Graphene Conductors via Aerosol Jetting” is published in Advanced Engineering Materials, March 25. 2022.

Posted on March 25, 2022 by sren
Posted in Uncategorized

“Copper Nanoplates for Printing Flexible High-Temperature Conductor” is published in ACS Applied Nano Materials, February 18, 2022.

Posted on February 18, 2022 by sren
Posted in Uncategorized

“High temperature ceramic thermal insulation material” is published in Nano Research, February 14, 2022.

Posted on February 14, 2022 by sren
Posted in Uncategorized

Yong Hu received the 1st Place award in the 2021 Materials Research Society (MRS) Science as Art Competition.

Posted on February 1, 2022 by sren
Posted in Uncategorized

“A Predictive Multiphase Model of Silica Aerogels for Building Envelope Insulations” is published in Computational Mechanics, January 27, 2022.

Posted on January 27, 2022 by sren
Posted in Uncategorized

“Scalable and robust silica aerogel materials from ambient pressure drying” is published in Materials Advances, January 27, 2022.

Posted on January 27, 2022 by sren
Posted in Uncategorized

“Nanoengineering Porous Silica for Thermal Management” is published in ACS Applied Nano Materials, January 27, 2022.

Posted on January 27, 2022 by sren
Posted in Uncategorized

“ Printing Air-Stable High-Tc Molecular Magnet with Tunable Magnetic Interaction.” is published in Nano Letters, January 4, 2022.

Posted on January 4, 2022 by sren
Posted in Uncategorized

“Printed copper-nanoplate conductor for electro-magnetic interference.” is published in Nanotechnology, December 7, 2021.

Posted on December 8, 2021 by sren
Posted in Uncategorized

“Flexible Copper Nanowire Electronics for Wireless Dynamic Pressure Sensing.” is published in ACS Appl. Electron. Mater., November 22, 2021.

Posted on November 30, 2021 by sren
Posted in Uncategorized

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